1.92 inch 160×128 OLED Display Module

Model No.WEO160128B

  • Type: Graphic
  • Structure: COG
  • Size: 1.92 inch
  • 160×128 OLED
  • IC：CH1120
  • 3V Power supply
  • 1/128 duty
  • Interface: 6800, 8080, SPI, I2C
  • Display Color: White
  • Support Grayscale
Categories: ,

Description

WEO160128B is a 160×128 COG graphic OLED display module with a diagonal size of 1.92 inches. This model is built-in with CH1120 IC, supporting 6800/8080 parallel interfaces, I2C, and 4-wire SPI serial interfaces. The supply voltage for logic is 3V, the supply voltage for display is 12V, and it supports 4-bit grayscale. The OLED module has a high contrast ratio of 10,000:1(typical value) and a resolution of 160×128 dots.

This OLED module is suitable for medical applications, smart home applications, intelligent building systems (home and office), control panels for lighting or heating, smartwatches, and fitness watches. It can operate at temperature range from -40℃ to +80℃; its storage temperature range is from -40℃ to +85℃.

Drawing

Drawing

160x128 OLED, OLED 160x128, 1.92 OLED, 160128 OLED - WEO160128B

Data source ref: WEO160128BWPP3N00000

SPECIFICATIONS

SPECIFICATIONS

Interface Pin Function

No. Symbol Function
1 NC No connection
2 VPP This is the most positive voltage supply pad of the chip.
It should be supplied externally.
3 VSEGM This is a segment pre-charge voltage.
A capacitor can be connected between this pad and VSS if necessary. When external capacitor Is not used, this pin should be kept NC.
4 VCOMH This is a pad for the voltage output high level for common signals.
A capacitor should be connected between this pad and VSS.
5 VSL Discharge voltage level pad.
This pad should be connected to resistor and diode externally.
6 NC No connection
7 IREF This is a segment current reference pad.
A resistor should be connected between this pad and VSS. .
8 VPP This is the most positive voltage supply pad of the chip.
It should be supplied externally.
9 NC No connection
10 VSS Ground for logic and analog. This pad should be connected to GND externally.
11 VCL This is a common voltage reference pad.
This pad should be connected to VSS externally.
12 VDD Power supply for logic and input/output
13 IM0 These are the MPU interface mode select pads.

8080 3-Wire SPI 4-Wire SPI 6800 I2C
IM0 0 0 0 1 0
IM1 1 0 0 0 1
IM2 1 1 0 0 0
14 IM1
16 IM2
15 VDD Power supply for logic and input/output
17 CS This pad is the chip select input. When CSB = “L”, then the chip select becomes active, and data command I/O is enabled. When in I2C interface, this pin is not used, so it must be connected to “L”.
18 RES This is a reset signal input pad. When RESB is set to “L”, the settings are initialized. The reset operation is performed by the RESB signal level. This pin internal pull high.
19 A0 This is the Data/Command control pad that determines whether the data bits are data or a command.
A0 = “H “: the inputs at D0 to D7 are treated as display data.
A0 = “L “: the inputs at D0 to D7 are transferred to the command registers.
In I2C interface, this pad serves as SA0 to distinguish the different address of OLED driver. When in 3-wire interface, this pin is not used, so it must be connected to “L “.
20 WR This is a MPU interface input pad.
When connected to an 8080 MPU, this is active LOW. This pad connects to the 8080 MPU WR signal. The signals on the data bus are latched at the rising edge of the WR signal.
When connected to a 6800 Series MPU: This is the read/write control signal input terminal. When R/W = “H “: Read.
When R/W = “L “: Write.
When in 3-wire.4-wire & I2C interface, this pin is not used, so it must be connected to “L “.
21 RD This is a MPU interface input pad.
When connected to an 8080 series MPU, it is active LOW. This pad is connected to the RD signal of the 8080 series MPU, and the data bus is in an output status when this signal is “L”.
When connected to a 6800 series MPU, this is active HIGH. This is used as an enable clock input of the 6800 series MPU.
When in 3-wire.4-wire & I2C interface, this pin is not used, so it must be connected to “L”.
22 D0 This is an 8-bit bi-directional data bus that connects to an 8-bit or 16-bit standard MPU data bus.
When the serial interface(SPI) and I2C is selected, then D0 serves as the serial clock input pad (SCL) and D1 serves as the serial data input pad (SI). At this time, D2 to D7 are set to high impedance. D7~D2 is recommended to connect the VDD or GND. It is also allowed to leave D7~D2 unconnected.
23 D1
24 D2
25 D3
26 D4
27 D5
28 D6
29 D7
30 NC No connection
31 VPP This is the most positive voltage supply pad of the chip.
It should be supplied externally.

Mechanical Data

Mechanical Data

Item Dimension Unit
Dot Matrix 160 × 128 Dots
Module dimension 34.5 × 48.8 × 1.41 mm
Active Area 28.908 × 39.34 mm
Pixel Size 0.206 × 0.226 mm
Pixel Pitch 0.226 × 0.246 mm
Display Mode Passive Matrix
Display Color Monochrome
Drive Duty 1/128 Duty
IC CH1120
Interface 6800, 8080, SPI, I2C
Size 1.92 inch

 

Absolute Maximum Ratings

Absolute Maximum Ratings

Parameter Symbol Min Max Unit
Supply Voltage for Logic VDD -0.3 3.5 V
Supply Voltage for Display VPP -0.3 15.0 V
Operating Temperature TOP -40 +80 °C
Storage Temperature TSTG -40 +85 °C

Electronical Characteristics

Electronical Characteristics

Item Symbol Condition Min Typ Max Unit
Supply Voltage for Logic VDD － 1.65 3.0 3.5 V
Supply Voltage for Display VPP － 11.5 12.0 12.5 V
Input High Volt. VIH － 0.8xVDD － VDD V
Input Low Volt. VIL － VSS － 0.2xVDD V
Output High Volt. VOH IOH=-0.5mA 0.8xVDD － VDD V
Output Low Volt. VOL IOL=0.5mA VSS － 0.2xVDD V
Display 50% Pixel on IPP VPP=12V － 25 37.5 mA

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